Submissions

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Submission Preparation Checklist

As part of the submission process, authors are required to check off their submission's compliance with all of the following items, and submissions may be returned to authors that do not adhere to these guidelines.

  • The submission has not been previously published, nor is it before another journal for consideration (or an explanation has been provided in Comments to the Editor).
  • The submission file is in OpenOffice, Microsoft Word, or RTF document file format.
  • Where available, URLs for the references have been provided.
  • The text is single-spaced; uses a 12-point font; employs italics, rather than underlining (except with URL addresses); and all illustrations, figures, and tables are placed within the text at the appropriate points, rather than at the end.
  • The text adheres to the stylistic and bibliographic requirements outlined in the Author Guidelines.

Author Guidelines

We are pleased to welcome submissions to Communications on Electrical and Electronics Engineering (CEEE). To ensure a smooth submission and review process, please carefully adhere to the following author guidelines.

Scope of the Journal

CEEE publishes original research articles, review papers, case studies, and technical notes in all areas of electrical and electronics engineering. Topics include, but are not limited to:

  • Power systems, renewable energy, and smart grids
  • Signal processing and wireless communications
  • Robotics, control systems, and automation
  • Microelectronics and embedded systems
  • Electromagnetic theory and applications
  • Artificial intelligence in electrical engineering

All submissions should contribute new knowledge, innovation, or applications relevant to these fields.

Manuscript Categories

We accept the following types of manuscripts:

  • Original Research Articles: Reports of significant and novel research findings. (6,000–8,000 words)
  • Review Articles: Comprehensive overviews of a specific area, highlighting recent developments and future directions. (8,000–10,000 words)
  • Technical Notes: Short communications on innovative techniques, methodologies, or findings. (2,000–3,000 words)
  • Case Studies: Practical applications or real-world problem-solving in engineering contexts. (3,000–5,000 words)

Word counts include text, references, and captions.

Submission Guidelines

Manuscript Preparation

Authors should prepare their manuscripts using the following structure:

Title Page: Include the manuscript title, full names of all authors, affiliations, and contact details for the corresponding author.

Abstract: Provide a concise summary (150–250 words) of the research, including objectives, methods, results, and conclusions.

Keywords: List 4–6 keywords that best describe the content.

Main Text: Organize the manuscript into the following sections:

Introduction: State the background, research gap, and objectives.

Methodology: Describe the materials, methods, and procedures in detail.

Results and Discussion: Present and interpret the findings. Use figures and tables as necessary.

Conclusion: Summarize the key outcomes and their implications.

Acknowledgments: Recognize contributions from individuals or organizations.

References: List all citations in IEEE format. Ensure accuracy and completeness.

Formatting Requirements

  • Use double-spacing and a standard font (e.g., Times New Roman, 12 pt).
  • Number all pages consecutively.
  • Figures, tables, and equations should be clearly labeled and embedded in the manuscript text. Submit high-resolution versions separately if needed.

A Microsoft Word template for manuscript preparation can be accessed through:

[Download Template]

File Formats

Manuscripts should be submitted as Microsoft Word (.docx) or LaTeX files. Figures and supplementary materials should be in .png, .jpeg, or .pdf formats.

Submission Process

Online Submission

Manuscripts must be submitted through our online submission system [insert link]. Authors must create an account and follow the step-by-step instructions to upload their manuscript and supplementary files.

Cover Letter

Each submission must include a cover letter addressed to the Editor-in-Chief. The letter should summarize the manuscript’s contribution, relevance to the journal, and any potential conflicts of interest.

Peer Review Process

All submissions undergo a rigorous double-blind peer-review process. Authors should ensure that their manuscript is anonymized, removing all identifying information.

Ethical Considerations

Originality and Plagiarism

Submissions must be original and not under consideration elsewhere. Manuscripts will be screened for plagiarism using software tools. Any instances of plagiarism will result in rejection.

Author Contributions

Authors must clearly state the individual contributions of each co-author using the CRediT taxonomy (e.g., conceptualization, data curation, writing).

Conflict of Interest

Authors must disclose any financial or personal relationships that could influence their work.

Data Availability

Authors should provide access to supporting data upon request and comply with FAIR principles (Findable, Accessible, Interoperable, Reusable).

Post-Acceptance

Proofreading

Once accepted, manuscripts will undergo professional copyediting and typesetting. Authors will receive proofs for review. Timely feedback is required to ensure publication deadlines are met.

Open Access Policy

CEEE is an open-access journal. All articles are freely available to readers worldwide. Authors may be required to pay an Article Processing Charge (APC) upon acceptance. Details are available on the journal website.

Copyright and Licensing

Authors retain copyright under a Creative Commons Attribution License (CC BY), allowing others to share and adapt the work with proper attribution.

Contact Information

For inquiries, please contact:
Editorial Office – Communications on Electrical and Electronics Engineering
Email: ceee@mri-pub.com

We look forward to receiving your submissions and contributing to the advancement of research in electrical and electronics engineering.

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