MÜLLER, Klaus; SCHMIDT, Anne; WAGNER, Peter. Wafer Defect Inspection via Unsupervised Anomaly Detection. Optimizations in Applied Machine Learning, [S. l.], v. 1, n. 1, 2021. Disponível em: https://ojs.mri-pub.com/index.php/OAML/article/view/42. Acesso em: 4 feb. 2026.